4.6 Article

Novel plasma-assisted combustion route for NiOxthin film deposition

Journal

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 31, Issue 22, Pages 19836-19845

Publisher

SPRINGER
DOI: 10.1007/s10854-020-04507-z

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Funding

  1. Science and Engineering Research Board
  2. Ministry of New and Renewable Energy
  3. IIT Bombay

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The emerging field of flexible electronics demands low-temperature, high-throughput solution-processable thin films of oxide semiconductors. Towards this goal, we report a novel low-temperature synthesis route that is primarily in a combination of solution combustion synthesis and plasma irradiation to deposit p-type nonstoichiometric NiO(x)thin films at a relatively lower temperature range. The film morphology was studied by atomic force microscope (AFM) and scanning electron microscope (SEM) while the crystallographic information was obtained from X-ray diffraction (XRD) studies. The NiO(x)formation mechanism is extensively studied with X-ray photoelectron spectroscopy (XPS) measurements. Here we reveal the conditional analysis to optimize the Ni(3+)concentration that essentially controls the net free carrier in the nonstoichiometric NiO thin films. Based on our understanding, the plasma treatment not only plays a deterministic role in the material and the defect formation but is also efficient in removal of chemical impurity to obtain crystalline NiO thin films. Temperature-dependent (130-303 K) electrical resistivity measurements revealed that variable-range hopping (VRH) is the dominant hole transport process in this material.

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