Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 283, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jmatprotec.2020.116720
Keywords
Elliptical vibration cutting; Brittle materials; Silicon; Ductile regime
Funding
- McCormick School of Engineering, Northwestern University, Evanston, IL, USA
- Innovation and Technology Fund, Hong Kong [ITS/076/17]
- Shun Hing Institute of Advanced Engineering, Chinese University of Hong Kong [RNE-p4-17]
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This study investigates the ductile-to-brittle transition behavior in elliptical vibration cutting (EVC) of silicon and identifies the practical process window for ductile-regime cuffing. EVC has been reported to increase the critical depth of ductile-regime cutting of silicon. This study demonstrates that the enhanced ductile cutting performance, however, is only optimal in a carefully-determined process window. The vibration amplitudes and nominal cutting velocity have significant impacts on the ductile-to-brittle transition behaviors. Systematic experiments covering a wide span of vibration amplitudes and cutting velocity have been conducted to investigate their effects. Two quantitative performance indices, the critical depth and ductile ratio, are utilized to analyze cutting performance by considering two unique characteristics of elliptical vibration cuffing, i.e., the time-varying undeformed chip thickness and effective cutting direction angle. The results show that there exists a lower bound for the nominal cutting velocity to ensure the ductile-regime material removal, besides the wellknown upper bound. Besides, the increases of vibration amplitudes in both the cutting and depth-of-cut (DOC) directions first enhance but then deteriorate the cutting performance. Based on the theoretical analysis and experimental results, the optimal process parameters have been recommended for the elliptical vibration cutting of silicon.
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