Journal
COMPOSITES PART B-ENGINEERING
Volume 198, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2020.108167
Keywords
Diamond; Silicon carbide; Thermal conductivity; Polymer composites
Funding
- National Natural Science Foundation of China [51573201]
- Public Welfare Project of Zhejiang Province [2016C31026]
- NSFC-Zhejiang Joint Fund for the Integration of Industrialization and Informatization [U1709205]
- Scientific Instrument Developing Project of the Chinese Academy of Sciences [YZ201640]
- Strategic Priority Research Program of the Chinese Academy of Sciences [XDA22000000]
- National Defense Key Laboratory Fund [6142807180511, 6142905192806]
- Science and Technology Major Project of Ningbo [2016S1002, 2016B10038]
- Science and Technology Innovation 2025 Major Project of Ningbo [2018B10046]
- 3315 Program of Ningbo
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Polymeric composites with the advantages of easy process, light weight and good chemical resistance were employed in thermal management. The construction of a new type thermal conductive filler has become an efficient method for improving the thermal transportation performance of polymer composite. In this work, a barnacle-like nano-crystalline diamond@silicon carbide (ND@SiC) is prepared through depositing ND on SiC powders in a hot filament chemical vapor deposition (HFCVD). ND@SiC/PVDF composite was prepared and their thermal transportation properties were investigated. The obtained composites with 70 wt% ND@SiC loading exhibit a high thermal conductivity of 2.39 W m(-1) K-1, which increased by 1132% in comparison with the pure polymer. It is also much higher than that of the composite adding 70 wt% SiC powders (1.48 W m(-1) K-1). The high thermal conductivity of polymer composites by adding the ND@SiC filler is mainly attributed to the novel barnacle-like structure. This work provides a new idea to significantly enhance thermal transportation properties of composites as used in advanced packaging materials.
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