Related references
Note: Only part of the references are listed.Influence of particle/solid surface zeta potential on particle adsorption kinetics
Kunal V. Savaji et al.
JOURNAL OF COLLOID AND INTERFACE SCIENCE (2014)
Electrochemical Characterizations and CMP Performance of Ru Slurry
Tom Shi et al.
CHEMICAL MECHANICAL POLISHING 12 (2013)
Electrochemical oxidation behavior of titanium nitride based electrocatalysts under PEM fuel cell conditions
Bharat Avasarala et al.
ELECTROCHIMICA ACTA (2010)
Property improvement of copper films with zirconium additive for ULSI interconnects
Ying Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effects of oxidant additives for exact selectivity control of W- and Ti-CMP process
YJ Seo et al.
MICROELECTRONIC ENGINEERING (2005)
Reliability challenges for copper interconnects
BZ Li et al.
MICROELECTRONICS RELIABILITY (2004)
Effects of oxidants on the removal of tungsten in CMP process
G Lim et al.
WEAR (2004)
Role of interaction forces in controlling the stability and polishing performance of CMP slurries
GB Basim et al.
JOURNAL OF COLLOID AND INTERFACE SCIENCE (2003)
Role of oxidizer in the chemical mechanical planarization of the Ti/TiN barrier layer
VS Chathapuram et al.
MICROELECTRONIC ENGINEERING (2003)
Effects of phosphoric acid stabilizer on copper and tantalum nitride CMP
NH Kim et al.
MATERIALS LETTERS (2003)
Application of a CMP model to tungsten CMP
E Paul
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2001)
Copper electroplating for future ultralarge scale integration interconnection
WC Gau et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS (2000)
Share Paper
