Journal
CARBON
Volume 167, Issue -, Pages 523-529Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2020.06.047
Keywords
SWCNT; Electromagnetic interference; Shielding effectiveness; Metallic SWCNT; Semiconducting SWCNT
Funding
- Korea Institute of Science and Technology (KIST, Korea) Institutional Program [2Z06230]
- National Research Foundation of Korea (NRF) - Korea government (MSIT) [2020R1C1C100500511]
- National Research Foundation of Korea [4120200213772, 2020R1F1A1072441] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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Enhancing the electromagnetic interference (EMI) shielding effectiveness (SH EF) with lightweight materials is a significant challenge. Herein, we introduce the fabrication of a heterogeneous metallic and semiconducting single-walled carbon nanotube (SWCNT) from the current synthetic method into films to optimize EMI SH EF. Because EMI SH EF can be affected by absorption and reflectance attenuation, optimizing the ratio of the metallic or semiconducting nature of SWCNT as a homogeneous electronic grade is critical. We optimized the SWCNT thin film as a homogeneous electronic grade and compared the EMI SH EF performance between them, with mechanistic insights. Specifically, we tuned the ratio of the metallic (m-) and semiconducting (s-) SWCNT in thin film and determined the EMI SH EF. Electronically pure m-SWCNT thin films showed the higher EMI SH EF than s-SWCNT thin film with the comparable tube length. Furthermore, a 1.2 mm thick film of sorted SWCNT exhibited a maximum EMI SH EF of approximately 35 dB with 3 mg of the lightweight film, and the highest normalized specific EMI SH EF (ESE/t), which is the EMI SH EF normalized by the density and thickness of the film, obtained herein was 153,333 dB cm(2) g(-1) in the frequency range of 12-19 GHz. Our findings demonstrate a substantial material design paradigm for the creation of next-generation material for high-performance EMI SH EF. (C) 2020 Elsevier Ltd. All rights reserved. Superscript/Subscript Available
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