Journal
APPLIED PHYSICS LETTERS
Volume 117, Issue 8, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/5.0021153
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Funding
- American Society for Engineering Education (ASEE) postdoctoral fellow program
- Office of Naval Research
- AFOSR Grant [FA9550-18-1-0066]
- Advanced Research Projects Agency-Energy
- U.S. Department of Energy's National Nuclear Security Administration [DE-NA0003525]
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Plasma etching of p-type GaN creates n-type nitrogen vacancy (V-N) defects at the etched surface, which can be detrimental to device performance. In mesa isolated diodes, etch damage on the sidewalls degrades the ideality factor and leakage current. A treatment was developed to recover both the ideality factor and leakage current, which uses UV/O-3 treatment to oxidize the damaged layers followed by HF etching to remove them. The temperature dependent I-V measurement shows that the reverse leakage transport mechanism is dominated by Poole-Frenkel emission at room temperature through the etch-induced V-N defect. Depth resolved cathodoluminescence confirms that the damage is limited to first several nanometers and is consistent with the V-N defect.
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