4.7 Article

Fabrication of a polymer composite with high thermal conductivity based on sintered silicon nitride foam

Journal

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2016.08.022

Keywords

Polymer-matrix composites (PMCs); 3-Dimensional reinforcement; Thermal properties; Silicon nitride foams

Funding

  1. National Natural Science Foundation of China [51372274, 51502343, 91426304]
  2. aid program for Science and Technology Innovative Research Team in Higher Educational Institutions of Hunan Province
  3. aid program for Group of National University of Defense Technology and innovation project for graduate students in Hunan Province

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A novel route was developed to fabricate Si3N4/epoxy composite. In this route, the Si3N4 particles were constructed into the foamed shape by using protein foaming method, firstly. Then the Si3N4 foams were sintered to bond these Si3N4 particles together. Finally, the Si3N4/epoxy composite was fabricated by infiltrating the epoxy resin solution into the sintered Si3N4 foams. This route was proved to be an efficient way in enhancing the thermal conductivity of epoxy matrix at a low loading fraction. For example, the thermal conductivity of the as-prepared Si3N4/epoxy composite with a loading fraction of 22.2 vol% was up to 3.89 W m(-1) K-1, which was about 17 times higher than that of neat epoxy. (C) 2016 Elsevier Ltd. All rights reserved.

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