Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 12, Issue 36, Pages 40859-40869Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.0c09020
Keywords
multifunctional TCF; interfacial adhesive; EMI shielding; AgNW; MXene
Funding
- National Natural Science Foundation of China [51903223, U1604253]
- China Postdoctoral Science Foundation [2018M642781]
- National Key RAMP
- D Program of China [2019YFA0706802]
- Open Funding Project of National Key Laboratory of Human Factors Engineering [SYFD061910K]
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Transparent conductive film (TCF) is promising for optoelectronic instrument applications. However, designing a robust, stable, and flexible TCF that can shield electromagnetic waves and work in harsh conditions remains a challenge. Herein, a multifunctional and flexible TCF with effective electromagnetic interference shielding (EMI) performance and outstanding electro-photo-thermal effect is proposed by orderly coating Ti3C2Tx MXene and a silver nanowire (AgNW) hybrid conductive network using a simple and scalable solution-processed method. Typically, the air-plasma-treated polycarbonate (PC) film was sequentially spray-coated with MXene and AgNW to construct a highly conductive network, which was transferred and partly embedded into an ultrathin poly(vinyl alcohol) (PVA) film using spin coating coupled with hot pressing to enhance the interfacial adhesion. The peeled MXene/AgNW-PVA TCF exhibits an optimal optical and electrical performance of sheet resistance 18.3 Omega/sq and transmittance 52.3%. As a consequence, the TCF reveals an effective EMI shielding efficiency of 32 dB in X-band with strong interfacial adhesion and satisfactory flexibility. Moreover, the high electrical conductivity and localized surface plasmon resonance (LSPR) effect of hybrid conductive network endow the TCF with low-voltage-driven Joule heating performance and excellent photothermal effect, respectively, which can ensure the normal functioning under extreme cold condition. In view of the comprehensive performance, this work offers new solutions for next-generation transparent EMI shielding challenges.
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