4.7 Article

Process response of Inconel 718 to wire + arc additive manufacturing with cold metal transfer

Journal

MATERIALS & DESIGN
Volume 195, Issue -, Pages -

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2020.109031

Keywords

Additive manufacturing; Nickel alloys; Process stability; Microstructure; Hardness; Heat treatment

Funding

  1. BP through the BP International Centre for Advanced Materials (BP-ICAM)
  2. EPSRC through the Materials for Demanding Environments Centre for Doctoral Training [EP/L01680X/1]
  3. Royal Academy of Engineering UK
  4. EPSRC [EP/S019367/1, EP/P025021/1] Funding Source: UKRI

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Wire + arc additive manufacturing (WAAM) with cold metal transfer (CMT) process can reduce cost and lead time during the production of large-scale Ni-based components used in the transportation and energy sector. This paper investigates the effects of processing parameters and heat treatments employed on CMT-WAAM of a precipitation hardenable Ni-based alloy - Inconel 718. The process stability was analysed by electrical transients and melt pool imaging, showing an opposite trend to the measured heat inputs. A 1.2 mm diameter wire permitted deposition widths of 5.92-13.15 mm, but widths larger than similar to 10 mm decreased the arc stability considerably. Laves length and carbide diameter decreased with travel speed, while the as-deposited hardness increased. These observations permitted a linear wall to be fabricated with a minimal heat input per layer of 181-185 J/mm. An increase in the solution treatment temperature from 980 to 1040 degrees C reduced microsegregation, Laves and delta phase precipitation. Localised regions with high microhardness were found near interlayer regions due to a local dissolution of Nb-rich eutectic phases. Compared to powder-based additive manufacturing, CMT-WAAM IN718 exhibits a larger melt pool size and lower as-deposited hardness, but has been found to show satisfactory ageing response and similar Laves phase area fraction. (c) 2020 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).

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