Journal
POLYMER DEGRADATION AND STABILITY
Volume 176, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.polymdegradstab.2020.109143
Keywords
Epoxy resin; Thermal properties; Carborane; Thermal degradation mechanism
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Funding
- National Natural Science Foundation of China [31470686]
- Outstanding Youth Talent Training Plan of Shandong Agriculture University [564028]
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To generate a novel heat-resistant phenolic epoxy resin, carborane containing curing agent (1,7-bis(aminophenylene)meta-carborane) was synthesized and applied to cure the resin. The generated carborane-containing phenolic epoxy resin showed better thermal stability and thermal oxidative stability than carborane free phenolic epoxy resin. And the Lap Shear Strength of bonding samples showed the improved bonding performances. The thermal degradation mechanism of carborane-epoxy resin was investigated and the results showed that the carborane of samples was gradually oxidized to B2O3 at high temperatures, which covered at the surface of the adhesives to maintain the thermal resistance at high temperature. (C) 2020 Elsevier Ltd. All rights reserved.
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