4.6 Article

Developing low boiling point solvent additives directly based on non-fullerene based active layer: Higher efficiency and better thickness tolerance

Journal

ORGANIC ELECTRONICS
Volume 83, Issue -, Pages -

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ELSEVIER
DOI: 10.1016/j.orgel.2020.105762

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Funding

  1. National Natural Science Foundation of China [51521002, 91633301, U1401244]

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