Journal
OPTICS EXPRESS
Volume 28, Issue 14, Pages 19901-19915Publisher
OPTICAL SOC AMER
DOI: 10.1364/OE.394177
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Funding
- National Demonstration Center for Experimental Opto-Electronic Engineering Education
- Higher Education Discipline Innovation Project [D17017]
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We propose a THz nondestructive analysis method based on multiple echoes and feature fusion. Conventionally, it is difficult to identify the debonding defects of the glue layer (II) due to the thin adhesive layer. To this end, a THz propagation model is established, and a quantitative method for determining the thickness of debonding defects based on multiple echoes is presented. The measurement error for preset defect thickness of 500 mu m was 4%. Further, for determining the area of debonding defects, a feature fusion imaging algorithm is proposed to realize the lateral recognition of defects and quantitative analysis is used to improve the recognition ability of defects. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreement
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