4.8 Article

Reliable high temperature, high humidity flexible thin film encapsulation using Al2O3/MgO nanolaminates for flexible OLEDs

Journal

NANO RESEARCH
Volume 13, Issue 10, Pages 2716-2725

Publisher

TSINGHUA UNIV PRESS
DOI: 10.1007/s12274-020-2915-5

Keywords

thin film encapsulation; nanolaminate structure; Al2O3; MgO; flexible; organic light emitting diode (OLED)

Funding

  1. Engineering Research Center of Excellence (ERC) Program by National Research Foundation (NRF) of the Korean Ministry of Science, ICT & Future Planning (MSIP) [NRF-2017R1A5A1014708]

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Since most organic materials are very sensitive to moisture and oxygen, organic light emitting diodes (OLEDs) require an encapsulation layer to protect the active layer from these gases. Since light, flexible and portable OLEDs are being employed in more diverse climates and environmental conditions, the OLED encapsulation layer must retain robust mechanical properties and stability in high temperature/high humidity conditions. Al(2)O(3)films have demonstrated excellent barrier performance, but they readily hydrolyze when exposed to prolonged harsh environments. In this study, we fabricated a thin film encapsulation (TFE) film that was resistant to hydrolysis, using Al2O3/MgO (AM) nanolaminates. MgO has superior resistance to harsh environments, and the aluminate phase generated by the chemical reaction of Al(2)O(3)and MgO provided excellent barrier performance, even after storage in harsh conditions. A multi-barrier fabricated using the AM nanolaminate showed excellent barrier performance, close to the level required by OLEDs. It did not significantly deteriorate even after a bending test of 1,000 iterations at 0.63% strain. After 1,000 cycle of bending, the electrical properties of the passivated OLEDs were not significantly degraded at shelf-lifetime test where the fabricated device was stored for 50 days in a harsh environment of 60 degrees C, 90% relative humidity. The multi-barrier shows the best performance compared to previous studies on flexible encapsulation that can be used in harsh environments.

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