Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 792, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2020.139825
Keywords
Transient liquid phase bonding; Copper interlayer; Intermetallic compound; Shear strength; Eutectic liquid; Brazing zone
Ask authors/readers for more resources
Transient liquid phase (TLP) technique has excellent potential for producing bimetallic devices in medical applications. TLP bonding between Co-Cr-Mo and Ti-6Al-4V metallic biomaterials was carried out using copper interlayer with a thickness of 10 mu m at the bonding temperature of 900, 920, 940, and 960 degrees C. The effect of bonding temperature on the microstructural and mechanical characteristics was investigated. The results showed that the increase in the bonding temperature leads to the enlargement of the interfacial brazing zone (IBZ). Also, the reactive layer width is enlarged due to the increase in the eutectic liquid volume. Several intermetallic compounds such as Ti(Co, Cu), Ti-2(Co, Cu), and CoCr(Ti, Mo) are identified in the IBZ. The bonded joint at 920 degrees C has the maximum strength equal to 277 MPa. The cleavage pattern dominates on the fracture surfaces owing to the formation of brittle phases in the dissimilar joints. The diffusion layer of the Co-Cr-Mo base metal has the highest hardness in the IBZ.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available