Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 790, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2020.139687
Keywords
Copper; Harmonic structure; Thermomechanical processing; Strain hardening; Mechanical properties
Categories
Funding
- National Natural Science Foundation of China [51901007]
- JSPS, Japan [JP18H05256]
- 111 Project [B17002]
- National 863 Project [2013AA031001]
- International Science and Technology Cooperation Program of China [2015DFA51430]
- China Scholarship Council (CSC) fund, China
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In this study, thermomechanical processing (TMP) including cold rolling and subsequent annealing was applied to a novel ti-dimensional core/shell structured (Harmonic Structure, HS) pure Cu. Detailed microstructure observation by electron backscattering diffraction (EBSD) suggested that it was possible to manipulate the volume fraction and the grain size of the core/shell via TMP. Tensile tests revealed that the mechanical properties of the HS designed pure Cu can be further optimized by appropriate TMP. For instance, the ultimate tensile strength and total elongation of the TMP30% sample (CR30%+annealing at 673 K for 1.8 ks) were 279 MPa and 51%, respectively, which were simultaneously higher than those of the original HS sample. The underlying mechanisms for the improved strength and ductility in the TMP processed samples were discussed based on the change of microstructures during cold rolling and annealing.
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