4.7 Article

Thermal design of a spherical electronic device naturally cooled by means of water-copper nanofluid saturated porous media

Journal

JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Volume 145, Issue 6, Pages 3141-3149

Publisher

SPRINGER
DOI: 10.1007/s10973-020-09851-0

Keywords

Thermal control; Cu-H2O nanofluid; Natural convection; Porous media; Electronics applications; Heat transfer; Spherical cavity

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This study focuses on optimizing thermal regulation of a spherical electronic device used in naval navigation techniques by adjusting the thermal conductivity ratio, volume fraction, and Rayleigh number. The results show that the thermal conductivity ratio has a significant influence on the device's average surface temperature, while the volume fraction has a moderate impact within the considered range of Rayleigh number. The findings help enhance the reliability and thermal sizing design of the assembly.
The present work deals with thermal regulation of a spherical electronic device used in naval navigation techniques. Cooling is achieved by means of porous media saturated with water-copper nanofluid contained in another sphere kept isothermal. Nanofluid volume fraction varies between 0 (pure water) and 5%, Rayleigh number ranges from 6.5 x 10(6) to 1.32 x 10(9), while ratio between the thermal conductivity of the porous material's matrix and that of water varies in the 0-40 range. Results for different configurations obtained through variation of these three influencing parameters show that the thermal conductivity ratio has a strong influence on the component's average surface temperature, while the fraction volume has a moderate influence throughout the range of the considered Rayleigh number. Evolution of the average temperature versus the Rayleigh number is conventional of the power type. It can be calculated through the correlation proposed in this work for any combination of the three influencing parameters. This work complements a recent study where heat transfer occurring around the active sphere is quantified. This optimizes the thermal sizing of the assembly and enhances its reliability.

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