Enhancing thermal conductivity of C/SiC composites containing heat transfer channels

In this study, CNTs/SiC micro-pillars at controlled content ratios were introduced into C/SiC composites as heat transfer channels to improve the thermal conductivity in the thickness direction. The thermal conductivities and bending strengths before and after heat treatment at 1650 degrees C were investigated and the results were discussed. The theoretical calculations and finite element analyses confirmed that CNTs/SiC micro-pillars successfully worked as heat transfer channels. The theoretical thermal conductivity calculated by effective medium theory (EMT) model was 19.25 W/m-k and agreed-well with the experimental value. The measured thermal conductivity was estimated to 20.69 W/m-k and improved to 22.36 W/m-k after heat treatment. The latter was 3.56-fold higher than that of traditional C/SiC and attributed to increased grain growth during heat treatment. The optimal bending strength before heat treatment was recorded as 324.5 +/- 23.74 MPa due to microstructure evolution caused by CNTs. After heat treatment, the bending strength improved by 138 % with ductile fracture mode attributed to ordered layer structure of PyC interphase and complex phase composition of the composites. These features benefited the abundant propagation of cracks and energy consumption. In sum, introduction of heat transfer channels into C/SiC composites provided a new way to improve the thermal conductivity in thickness direction of ceramic matrix composites.