4.5 Article

Fabrication of Freestanding Metallic Ni-Mo-W Microcantilever Beams With High Dimensional Stability

Journal

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 29, Issue 3, Pages 329-337

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2019.2958862

Keywords

Stress; Micromechanical devices; Thermal stability; Metals; Sputtering; Microstructure; Temperature measurement; Microcantilevers; microelectromechanical systems (MEMS); microfabrication; nickel alloys; sputter deposition

Funding

  1. National Science Foundation [GOALI DMR-1410301]
  2. Department of Energy Basic Engineering Sciences [DE-FG02-07ER46437]
  3. Johns Hopkins Cohen Translational Engineering Fund
  4. NSF National Nanotechnology Coordinated Infrastructure Program [NNCI-1542153]

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Recent studies have elucidated a promising balance of physical and mechanical properties of sputter deposited nickel-molybdenum-tungsten (Ni-Mo-W) films that have a unique nanotwinned microstructure and promising potential for use in high temperature microelectromechanical systems (MEMS). The current study was undertaken to establish the feasibility of making nanotwinned Ni-Mo-W microcantilevers with standard microfabrication processing, to assess their dimensional stability, and to demonstrate the possibility of using nanotwinned Ni-Mo-W in metal MEMS devices. Deposition of Ni-Mo-W films in commercial sputtering chambers revealed a wide processing window for the formation of the requisite nanotwinned microstructure. Conventional photolithography and etchants were employed to shape blanket Ni-Mo-W films into freestanding microcantilever beams. Monitoring microcantilever deflections via interferometry provided a direct measure of residual stresses and overall dimensional stability. Heat treatments of 200 degrees C and 400 degrees C were used to mimic wafer bonding temperatures. At 400 degrees C, microcantilevers exhibited modest stress relaxation, yielding beam deflection profiles on the nanometer scale and portending dimensional stability and control for future metal MEMS devices.

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