Recent advances in method of suppressing dendrite formation of tin-based solder alloys

With the trend towards miniaturization and high density in electronics, electrochemical migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue, causing the occurrence of short circuit and resulting in huge damage. ECM can be divided into four basic steps: path formation, anodic dissolution, ion migration, and deposition of metal ions. Presence of moisture, ionic pollutants, bias condition, spacing between the adjacent conductors, and chemistry of electrolyte significantly affect ECM behavior. Presently research effort to make clear the mechanism, kinetics, and effect of environmental factors on the ECM is the current focus of research and industrial community. Some methods have been proposed to prevent the ECM behavior of tin-based solder alloys. This work reviews briefly recent advances in method of inhibiting the ECM of tin and tin-based solder alloys. Some candidate strategies for slowing down dendrite growth for tin and tin-based solder alloys have been elaborated.