Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 156, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2020.119843
Keywords
Composite heat sink; Hotspot management; Pinfin; Electronic cooling; Energy-efficient
Categories
Funding
- BK21 plus program through the National Research Foundation (NRF) - Ministry of Education of Korea
Ask authors/readers for more resources
A power-efficient composite pinfin heat sink has been introduced to mitigate the temperature nonuniformity in a microprocessor with heterogeneous heat flux distribution. The proposed composite design was evaluated numerically, and its performance was compared with a non-composite design. The concept utilizes the difference in thermal conductivities of different metals to develop an efficient cooling solution. The heat sink was divided into two zones (hotspot zone and background zone) according to the heat flux distribution. Copper and aluminum were selected for the hotspot and background zones, respectively. The non-composite heat sink was designed with exactly the same geometric parameters, however, aluminum was used for the background as well as the hotspot zone. Both designs (composite and non-composite) were analyzed at different flow rates and heating conditions. The temperature nonuniformity, temperature rise, thermal resistance, and pumping power were evaluated to compare their thermohydraulic performances. The composite heat sink showed substantial enhancement in the thermal performance without any change in the pumping power. (C) 2020 Elsevier Ltd. All rights reserved.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available