Journal
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
Volume 67, Issue 6, Pages 1133-1138Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TNS.2020.2970102
Keywords
Radiation effects; Leakage currents; Logic gates; Current measurement; Semiconductor device measurement; Doping; Leakage current; n-channel laterally diffused metal oxide semiconductor field effect transistors (NLDMOSFETs); partially radiation-hardened; silicon-on-insulator (SOI); technology computer-aided design (TCAD) simulation; total ionizing dose (TID)
Funding
- National Natural Science Foundation of China [11690045, 61674015, 61771167, 61704039]
- Natural Science Foundation of Guangdong Province [2016A030311022]
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The electrical characteristics of silicon-on-insulator (SOI) n-channel laterally diffused metal oxide semiconductor field effect transistors (NLDMOSFETs) are examined after exposure to the total ionizing dose (TID). The devices are partially radiation hardened in that the gate oxide (GOX) and the field oxide (FOX) have undergone a hardening process, but not the buried oxide (BOX). Two bias conditions, OFF-state and all terminals grounded, during irradiation are examined. The irradiated device shows that the OFF-state leakage current ($I_{L}$ ) of these devices increases with the accumulated dose. The physical mechanisms for the $I_{L}$ are analyzed by technology computer-aided design (TCAD) simulation. The OFF-state leakage current ($I_{L}$ ) can be explained due to the effects of radiation-induced trapped charge at the BOX silicon interface.
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