Journal
CURRENT APPLIED PHYSICS
Volume 20, Issue 6, Pages 751-754Publisher
ELSEVIER
DOI: 10.1016/j.cap.2020.03.010
Keywords
Bi2SiO5; Thin film; High dielectric stability; Low annealing temperature
Funding
- Natural Science Foundation of China [51872335]
- Natural Science Foundation of Guangdong Province, China [2015A030311019]
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Excellent dielectric frequency, bias, and temperature stability of bismuth silicate (Bi2SiO5, BSO) thin films with a low dielectric loss has been obtained in this study. The thin films were prepared on Pt/Ti/SiO2/Si substrates by a chemical solution deposition method at a relatively low annealing temperature of 500 degrees C. The BSO films have a preferred growth along (200) orientation with dense fine-grained surface morphology. The dielectric constant and dielectric loss of the thin film annealed at 500 degrees C are 57 and 0.01, respectively, at 100 kHz, with little change between 1 kHz and 100 kHz and in the bias electric field range between-250 kV/cm and 250 kV/cm, indicating that the thin film exhibits a low dielectric loss as well as excellent frequency and bias field stability. The dielectric-temperature measurements confirmed that the BSO thin film annealed at 500 degrees C also has good temperature stability between 150 K and 450 K. Our results suggest that the BSO thin films have potential applications in the next-generation integrated capacitors.
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