Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 139, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2020.106062
Keywords
Vertically oriented multilayer graphene; SiC nanowires; Thermal conductivity; Three-dimensional structure
Funding
- National Key R&D Program of China [2017YFB0406200]
- Major science and technology projects of Anhui Province [18030901083]
- Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences [KFJ-STS-ZDTP-069]
- Strategic Priority Research Program of the Chinese Academy of Science [XDA13040505]
- Science and Technology Service Network Initiative of the Chinese Academy of Sciences (guide project for innovative and entrepreneurial) [KFJ-STS-SCYD-112]
- Key deployment project of the Chinese Academy of Sciences [KFZD-SW-416]
- Science and Technology Cooperation Project of Sichuan Province
- Chinese Academy of Sciences [2017JZ0028]
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The oriented graphene could construct an effective heat transfer path in composites with low filler loading. However, electrical conductivity and hygroscopicity caused by functionalized graphene has been ignored, which would decay the lifetime of power devices with the composites as thermal managing materials. In this work, SiC nanowires with high thermal conductivity and hydrophobicity were introduced into vertically oriented multilayer graphene in epoxy resin, constructing an effectively thermally conductive structure. In the structure, multilayer graphene coated with magnetic iron oxide particles responded to external magnetic field, which dramatically reduced the multilayer graphene loading in epoxy resin. When the fillers were rearranged by the magnetic field, the thermal conductivity of the composites reached 0.708 W/(mK), an enhancement of 311.6% compared to epoxy resin. Furthermore, SiC nanowires also damped the electrical conductivity (1.54 x 10(-13) S/cm) and hygroscopicity of epoxy composites. The design made it possible for the composites to be applied to electronic packaging field.
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