Journal
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
Volume 135, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.compositesa.2020.105933
Keywords
Polymer-matrix composites; Sandwich structures; Thermal properties; Electrical properties
Funding
- National Key R&D Program of China [2018YFA0702100]
- National Natural Science Foundation of China [51601005, U1601213]
- Beijing Natural Science Foundation [2182032]
- Beijing Nova Programme Interdisciplinary Cooperation Project [Z191100001119013]
- Fundamental Research Funds for the Central Universities
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Polymer-based thermal management materials with common homogeneous composition cannot meet the needs of both fast heat transfer and resistance to high-voltage breakdown, due to the coupling of the above two interrelated properties. Thus, a sandwich intercalated structure design is proposed to combine a novel boron nitride (BN)/poly (vinylidene fluoride) (PVDF) composites with synergistically improved thermal conductivity and breakdown strength in this study. Herein, the micro-BN/PVDF is constructed as the outer layer due to the contribution of orientated micro-BN to high thermal conductivity. Attributed to the confinement of interfacial charge in BN nano-sheets (BNNS)/PVDF layer, it is inserted into the micro-BN/PVDF homogenous composite to improve the breakdown strength. The obtained sandwich intercalated structure composite exhibits both high in-plane thermal conductivity (18.4 Wm(-1) K-1) and breakdown strength (96.7 kV/mm) at an equivalent filler loading about 40 wt%. In addition, the thermal management capability of the sandwich structure film is further demonstrated when used as substrate for the heat dissipation of a printed resistor, and a maximum temperature drop of 16 degrees C is exhibited, indicating much potential for thermal management application in flexible electronics.
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