Fabrication of Zinc Substrate Encapsulated by Fluoropolyurethane and Its Drag-Reduction Enhancement by Chemical Etching

A fluoropolyurethane-encapsulated process was designed to rapidly fabricate low-flow resistance surfaces on the zinc substrate. For the further enhancement of the drag-reduction effect, Cu2+-assisted chemical etching was introduced during the fabrication process, and its surface morphology, wettability, and flow-resistance properties in a microchannel were also studied. It is indicated that the zinc substrate with a micro-nanoscale roughness obtained by Cu2+-assisted nitric acid etching was superhydrophilic. However, after the etched zinc substrate is encapsulated with fluoropolyurethane, the superhydrophobic wettability can be obtained with a contact angle of 154.8 degrees +/- 2.5 degrees and a rolling angle of less than 10 degrees. As this newly fabricated surface was placed into a non-standard design microchannel, it was found that with the increase of Reynolds number, the drag-reduction rate of the superhydrophobic surface remained basically unchanged at 4.0% compared with the original zinc substrate. Furthermore, the prepared superhydrophobic surfaces exhibited outstanding reliability in most liquids.