Journal
MATERIALS
Volume 13, Issue 5, Pages -Publisher
MDPI
DOI: 10.3390/ma13051211
Keywords
nano-twinned Cu; toughness; thermal stability; electroplated Cu
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Funding
- Center for the Semiconductor Technology Research from The Featured Areas Research Center Program
- Ministry of Science and Technology, Taiwan [MOST-108-3017-F-009-003, MOST-108-3017-F-009-004]
- Research of Excellence (RoE) Program in the Center for Emergent Functional Matter Science of National Chiao Tung University [MOST 108-2633-E-009-001]
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Tensile tests on two kinds of electroplated copper foils with twins before and after annealing were performed. One electroplating parameter results in a microstructure of <110>-oriented microtwinned Cu (mt-Cu), and the other is <111>-oriented nanotwinned Cu (nt-Cu). The latter shows higher thermal stability than the former after annealing. Though the toughness for the two as-plated foils are quite close, the toughness for the <111> oriented nt-Cu increased from 34 to 74 MJ/m(3) after annealing at 250 degrees C for 3 h. In comparison, the toughness of the <110>-oriented mt-Cu remained almost the same after annealing.
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