4.8 Review

Toward Solution-Processed High-Performance Polymer Solar Cells: from Material Design to Device Engineering

Journal

CHEMISTRY OF MATERIALS
Volume 29, Issue 1, Pages 141-148

Publisher

AMER CHEMICAL SOC
DOI: 10.1021/acs.chemmater.6b02802

Keywords

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Funding

  1. Ministry of Science and Technology [2014CB643501]
  2. Natural Science Foundation of China [21520102006, 21490573]
  3. Guangdong Natural Science Foundation [S2012030006232]
  4. China Postdoctoral Science Foundation [2016M590773]

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With the rapid development of polymer solar cells (PSCs), the manufacture of high-performance large area PSC modules is becoming a critical issue in commercial applications. However, most of the reported light absorption materials and interfacial materials are quite thickness sensitive, with optimal thicknesses of around 100 and 5 nm, respectively. The thickness need to be precisely controlled, otherwise, a small variation in thickness can often lead to a sharp decrease in device performance, especially for interfacial materials. This increases the difficulty of apply these materials in the production of large area PSCs. To avoid the shortcomings of thickness-sensitive materials and achieve high-performance large area PSC modules, we designed and synthesized a series of high mobility donor materials and cathode interfacial materials. These materials exhibited excellent device performance at their optimal thicknesses and maintained high performance even with large thickness variations, thus providing a solution to the bottleneck problem in manufacturing PSC modules and enhancing the device reproducibility. We also developed a simple and efficient approach for achieving a large area cathode interlayer with controlled film composition, uniformity, and thickness at the nanometer-scale using an electrostatic layer-by-layer self-assembly (eLbL) process. The eLbL films exhibited excellent cathode modification ability and can be integrated into the current large area device processing techniques. Thus, our approaches from both material design to device engineering provide new solutions for preparing high-performance large area PSC modules.

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