Journal
CHEMISTRY OF MATERIALS
Volume 28, Issue 23, Pages 8443-8452Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acs.chemmater.6b03077
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Funding
- University of Waterloo
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The demand for materials and devices with dimensions on the nanometer scale continues to increase. To meet this demand, high-throughput, cost-effective methods for depositing nanoscale thin films are needed. In the past few years, atmospheric pressure spatial atomic layer deposition (AP-SALD) has emerged as a potential nanomanufacturing method that is scalable, open air, and operates at modest temperatures that are compatible with flexible substrates. In this Perspective, we compare AP-SALD to other high-throughput techniques for depositing nanometer-scale thin films, including gravure printing, screen printing, knife-over-edge coating, slot-die coating, inkjet printing, spray deposition, as well as high throughput sputtering and evaporation. Although AP-SALD does not provide the same patterning capabilities as some of these printing techniques, it offers multiple advantages: it produces continuous, conformal coatings with few defects; it requires minimal thermal treatment of the deposited materials; it provides atomic scale thickness control; it facilitates tuning of material properties; and no vacuum chamber is required, which simplifies maintenance requirements and minimizes the operating cost. Areas for further development are identified, which will allow these advantages to be leveraged: new precursors need to be developed to enable deposition of a wider variety of materials, precursor recycling should be examined, and AP-SAID systems that are high-throughput (roll-to-roll coating speeds of tens or hundreds of meters per minute) and low-maintenance need to be further developed and tested.
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