Journal
MICROELECTRONICS RELIABILITY
Volume 108, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.microrel.2020.113634
Keywords
Lead-free solder; Microstructure; Corrosion; Mechanical; Potentiodynamic polarization
Funding
- National Natural Science Foundation of China [U1637203]
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The aim of this study is to investigate the effects of variable micromorphology on the corrosion and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloy. Different SAC305 micromorphologies were obtained by controlling the cooling rate. The results of corrosion and mechanical tests showed that coarse second-phase Ag3Sn formed at lower cooling rates. Moreover, the coarse Ag3Sn reduced the corrosion resistance of SAC305 and exhibited irregular deformation around particles. In addition, the corrosion process of the SAC305 was illustrated by intermittent potentiodynamic polarization tests. This study has direct significance for the production and application of SAC305 under corrosion environments.
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