A new monitor model to detect damages in surface and subsurface during cup grinding process of BK7 optical glass: a new optimization model for energy damage

Grinding is known as the most widely used method of forming borosilicate optical glass (BK7). Due to the brittle nature of the BK7 glass, the predominant mechanism of material removal will be fracture. So, the surface under grinding will have surface (surface roughness) and subsurface damage. These damages will cause a decrease in mechanical resistance and performance. Modeling of surface and subsurface damages due to the grinding process using cup grinding tool has not been subjected in recent investigations. To do this, the surface roughness effects are investigated by changes in grinding parameters such as cutting speed, feed rate, cutting depth and table speed. Moreover, based on the experiments, the relationship between surface roughness and grinding parameters is simulated and the average error was 5.77%. In the second phase of the experiments, angular polishing method is used and subsurface morphologies are investigated by SEM and the depths of these damages are measured. Experimental results are compared with that of the Li theoretical model. Based on the results, the experimental and theoretical results have well consistency. In the end, based on the Li model, a new model based on the relationship between subsurface damage and grinding parameters is conducted.

Automated summary

This study investigates the formation mechanism of surface and subsurface damages during the grinding process of borosilicate optical glass, examining the impacts of different grinding parameters on surface roughness, and conducting research on subsurface morphologies using an angular polishing method. The results demonstrate a good consistency between experimental and theoretical models.