4.5 Article

Influence of Electron Transport Layer (TiO2) Thickness and Its Doping Density on the Performance of CH3NH3PbI3-Based Planar Perovskite Solar Cells

Journal

JOURNAL OF ELECTRONIC MATERIALS
Volume 49, Issue 6, Pages 3533-3539

Publisher

SPRINGER
DOI: 10.1007/s11664-020-08041-w

Keywords

CH3NH3PbI3; ETL thickness; contour map; ETL doping density; light I-V

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Simulation studies are vital to understanding solar cell performance and in optimal device design for high-efficiency solar cells. Cell performance is sensitive to many factors, including device architecture, energy band alignment at the interfaces, materials used for photogeneration, charge extraction, doping density and thickness of various layers. The role of electron transport layer (ETL) thickness and its doping density on device performance is explored in this work. As the ETL thickness is increased from 10 nm to 200 nm, both fill factor (FF) and efficiency remain high up to 40 nm, at 0.85 and 28.04%, respectively, and beyond 40 nm, they decrease gradually due to a sharp increase in series resistance, reaching zero at 200 nm. However, J(sc) and V-oc remained unchanged up to an ETL thickness of about 150 nm and 160 nm, respectively. These results were confirmed by contour plots of the simulated V-oc, J(sc), FF and efficiency results. We observed that when ETL approached 200 nm, J(sc) and V-oc decreased to zero and 0.88 V, respectively. This can be attributed to very high series resistance and recombination in the cell. Donor concentration variation in the ETL from 10(17)/cm(3) to 10(20)/cm(3) has much less impact on J(sc), and V-oc remains unchanged. However, fill factor and efficiency improved, which might be due to an increase in conductivity in the ETL. Our result shows that for an optimized device, with an AM 1.5 spectrum, a cell efficiency of 29.64% was achieved with V-oc, J(sc) and fill factor of 1.241 V, 28.70 mA/cm(2) and 0.83, respectively.

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