Journal
INTERNATIONAL JOURNAL OF MODERN PHYSICS B
Volume 34, Issue 8, Pages -Publisher
WORLD SCIENTIFIC PUBL CO PTE LTD
DOI: 10.1142/S0217979220500642
Keywords
Cu nanoparticles; composite solder; intermetallic compounds
Funding
- State Key Laboratory of Advanced Welding and Joining [AWJ-19Z04]
- Natural Science Foundation of China [51475220]
- Six talent peaks project in Jiangsu Province [XCL-022]
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In this study, the effects of Cu nanoparticles on the melting characteristics, wettability, interfacial reaction and mechanical properties of Sn-xCu (x = 0, 0.3, 0.7, 1.0, 1.5, 2.0) composite solders were investigated. Results show that the properties of the composite solder containing Cu nanoparticles were improved effectively. With the addition of Cu nanoparticles, the melting point of Sn-xCu solder decreased significantly, and the spreading area and the shear strength were increased by 10.3% and 23.2%, respectively. For the performance, the optimal addition of Cu nanoparticles was 0.7%. In addition, the growth of interfacial intermetallic compounds in Sn-xCu/Cu solder joints was inhibited by adding Cu nanoparticles.
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