Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 33, Issue 2, Pages 202-209Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TSM.2020.2976886
Keywords
Thin films; tungsten; hot-wire; atomic layer deposition; spectroscopic ellipsometry; scanning electron microscopy; X-ray diffraction; sheet resistance; contact resistance; transfer length; temperature coefficient of resistance; field effect
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Ultra-thin tungsten films were prepared using hotwire assisted atomic layer deposition. The film thickness ranged from 2.5 to 10 nm, as determined by spectroscopic ellipsometry and verified by scanning electron microscopy. The films were implemented in conventional Van der Pauw and circular transmission line method (CTLM) test structures, to explore the effect of film thickness on the sheet and contact resistance, temperature coefficient of resistance (TCR), and external electric field applied. All films exhibited linear current-voltage characteristics. The sheet resistance was shown to considerably vary across the wafer, due to the film thickness non-uniformity. The TCR values changed from positive to negative with decreasing the film thickness. A field-induced modulation of the sheet resistance up to similar to 4.6.10(-4) V-1 was obtained for a 2.5 nm thick film, larger than that generally observed for metals.
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