Journal
CHEMISTRYSELECT
Volume 5, Issue 3, Pages 1146-1152Publisher
WILEY-V C H VERLAG GMBH
DOI: 10.1002/slct.201902444
Keywords
Mechanical properties; PSA with diphenoxypyridine; Processability; Silicon-containing arylacetylene resin
Categories
Funding
- Fundamental Research Funds for the Central Universities [50321041917001]
Ask authors/readers for more resources
A novel silicon-containing arylacetylene resin called poly(dimethylsilylene-ethylene-phenoxypyridyloxy-phenylene-ethylene) (PSPPY) was made from 2,6-bis(4-ethynyl-phenoxy) pyridine and dimethyldichlorosilane by Grignard reactions. The structure and properties of the resin were characterized by H-1-NMR, FT-IR, GPC, XRD, DSC, TGA and universal testing machine. The resin has a wide processing window ranged from 35 degrees C to 155 degrees C. The cured resin shows excellent mechanical property, low dielectric property and high thermal stability. The flexural strength of the cured resin at room temperature reaches 58.7 MPa. The cured resin has dielectric constant 3.0-3.5, dielectric loss 0.008-0.040 in the frequency of 10(-1)-10(6) Hz, and low water uptake (0.8 %). The degradation temperature at 5 % weight loss and the residue at 800 degrees C of the cured resin arrive at 500 degrees C and 77.1 % in nitrogen atmosphere, respectively.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available