4.6 Article

Reactively Sputtered Sb-GaN Films and its Hetero-Junction Diode: The Exploration of the n-to-p Transition

Journal

COATINGS
Volume 10, Issue 3, Pages -

Publisher

MDPI
DOI: 10.3390/coatings10030210

Keywords

Sb acceptor; GaN; RF sputtering; thin film; hole concentration

Funding

  1. Ministry of Science and Technology of the Republic of China [107-2221-E-011-141-MY3]

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Sb anion-substituted gallium nitride films were fabricated by radio frequency reactive sputtering with single Sb-containing cermet targets with different Sb contents under Ar/N-2 atmosphere. n-type GaN films with electron concentration of (1.40 +/- 0.1) x 10(17) cm(-3) inverted to p-type Sb-GaN with hole concentration of (5.50 +/- 0.3) x 10(17) cm(-3). The bandgap energy of Sb anion-added Sb-GaN films decreased from 3.20 to 2.72 eV with increasing Sb concentration. The formation of p-type Sb-GaN is attributed to the formation of Ga vacancy at higher Sb concentration. The coexistence of Sb at the Ga cation site and N anion site is an interesting and important result, as GaNSb had been well developed for highly mismatched alloys. The hetero-junction with p-type Sb-GaN/n-Si diodes was all formed by radio frequency (RF) reactive sputtering technology. The electrical characteristics of Sb-GaN diode devices were investigated from -20 to 20 V at room temperature (RT).

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