Journal
ULTRAMICROSCOPY
Volume 208, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.ultramic.2019.112851
Keywords
HR-EBSD; Image registration; Additive manufacturing; Inconel 625; Residual stress; Geometrically necessary dislocations
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Funding
- Department of Defense (DoD) through the National Defense Science and Engineering Graduate Fellowship (NDSEG) Program
- ARCS Foundation
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In this study, the possibility of utilizing a computer vision algorithm, i.e., demons registration, to accurately remap electron backscatter diffraction patterns for high resolution electron backscatter diffraction (HR-EBSD) applications is presented. First, the angular resolution of demons registration is demonstrated to be lower than the conventional cross-correlation based method, particularly at misorientation angles >0.157 rad. In addition, GPU acceleration has been applied to significantly boost the speed of iterative registration between a pair of patterns with 0.175 rad misorientation to under 1 s. Second, demons registration is implemented as a first-pass remapping, followed by a second pass cross-correlation method, which results in angular resolution of similar to 0.5 x 10(-4) rad, a phantom stress value of similar to 35 MPa and phantom strain of similar to 2 x 10(-4), on dynamically simulated patterns, without the need of implementing robust fitting or iterative remapping. Lastly, the new remapping method is applied to a large experimental dataset collected from an as-built additively-manufactured Inconel 625 cube, which shows significant residual stresses built-up near the large columnar grain region and regularly arranged GND structures.
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