Journal
SCRIPTA MATERIALIA
Volume 178, Issue -, Pages 414-417Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2019.12.012
Keywords
Weld; Shape memory alloys (SMA); Dynamic recrystallization; Tension test
Categories
Funding
- National Key R&D Program of China [2018YFB1107900]
- National Natural Science Foundation of China [U1933129]
- Civil Aviation Administration of China [U1933129]
- Natural Science Foundation of Tianjin City [18JCQNJC04100]
- Science and Technology Planning Project of Sichuan Province [2018GZ0284]
- Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) [UID/EMS/00667/2019]
- Fundação para a Ciência e a Tecnologia [UID/EMS/00667/2019] Funding Source: FCT
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Ultrasonic spot welding of NiTi shape memory alloy with Cu interlayer was performed to understand the metallurgical joining mechanism at the materials' interface. Dynamic recrystallization of the Cu foil and high strain rate of the process induced a nano-scale transition layer composed of NiTiCu phase. The formation of this new phase occurs due to the frictional heating and shear deformation that is imposed by the ultrasonic vibration and contributes to the metallurgical bonding between the parent materials. Mechanical tension tests revealed that the joint with Cu interlayer presents enhanced strength. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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