Journal
SCRIPTA MATERIALIA
Volume 176, Issue -, Pages 23-27Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2019.09.029
Keywords
Ceramics; Metallizations; Nitrides; Copper; Electrical properties
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Funding
- Ministry of Education, Youth and Sports of the Czech Republic under the project OP VVV Electrical Engineering Technologies with High-Level of Embedded Intelligence [CZ.02.1.01/0.0/0.0/18_069/0009855]
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This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2O3 substrates. Scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) analyses on cross-sections have shown that the paste adhesion to AlN and Al2O3 is provided by different bonding mechanisms. The influence of different adhesion mechanisms on electrical and mechanical properties as well as the morphology of copper films on AlN and Al2O3 substrates are described in this paper. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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