Journal
MATERIALS RESEARCH BULLETIN
Volume 120, Issue -, Pages -Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.materresbull.2019.110606
Keywords
Few-layer h-BN; Composites; Solvothermal method; Anisotropic; Thermal properties
Categories
Funding
- National Natural Science Foundation of China [51571087]
- Natural Science Foundation of Hunan Province [2019JJ40028]
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Few-layer h-BN/Cu composites are successfully synthesized by solvothermal method and subsequently vacuum hot-pressing sintering process, and the influence of h-BN content on the thermal physics properties of composites is investigated. The thermal conductivity of the composites initially increase with increasing h-BN content, reaching a maximum of 428 W/(m-K) at 6 wt% h-BN. As the content of h-BN content further increased, the thermal conductivity decrease, which can be explained by the anisotropic thermal conductivity of h-BN and its distribution in the composites. The introduction of h-BN reduces the thermal expansion coefficient of the composites because of its low thermal expansion coefficient. These composites have potential applications in the field of electrical packaging.
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