Physically Based Finite Element Modeling Method to Predict Metallic Bonding in Cold Spray

The cold spray (CS) process is unique due to its high strain rate deformation and particle deposition in solid state. In situ investigation of this process is challenging. Therefore, numerical methods have been used to simulate this process and provide a better ground for furthering the understanding of the process physics. Metallurgical bonding occurs during the deformation process at the particle/substrate interface during coating build-up. Up to now, several studies have been performed to predict the material behavior during this process. Although several studies have been done to predict the bonding in CS, none of them was able to show the occurrence of localized metallurgical bonding. In this study, a novel modeling method is proposed to predict the occurrence and strength of localized metallurgical bonds in the CS process through finite element method. The process physics and implementation method are explained in details. Critical velocities of aluminum, copper, and nickel were predicted and compared with experimental data to validate the method. In addition, the proposed method is able to show the localized metallurgical bonding at the interface between particle and substrate. Comparison between the predicted bonding area with the proposed method and experimental data from the literature showed good agreement. Graphic