Related references
Note: Only part of the references are listed.Ultrasonic vibration-assisted metal forming: Constitutive modelling of acoustoplasticity and applications
Hossein Sedaghat et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)
Study of Complex Looping With Five Kinks in Thermosonic Wire Bonding by Using Variable-Length Link-Spring Model
Fuliang Wang et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2019)
THERMO-MECHANICAL MULTISCALE MODELING IN PLASTICITY OF METALS USING SMALL STRAIN THEORY
N. Munjas et al.
JOURNAL OF MECHANICS (2018)
OVERVIEW STUDY OF SOLDER JOINT RELIABLITY DUE TO CREEP DEFORMATION
V. Ramachandran et al.
JOURNAL OF MECHANICS (2018)
Microstructural study of copper free air balls in thermosonic wire bonding
C. J. Hang et al.
MICROELECTRONIC ENGINEERING (2008)
Bonding wire characterization using automatic deformability measurement
C. J. Hang et al.
MICROELECTRONIC ENGINEERING (2008)
Comprehensive dynamic analysis of wirebonding on Cu/low-K wafers
CL Yeh et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2006)
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers
CL Yeh et al.
MICROELECTRONICS RELIABILITY (2005)
Share Paper
