Journal
JOURNAL OF COLLOID AND INTERFACE SCIENCE
Volume 559, Issue -, Pages 226-235Publisher
ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2019.10.033
Keywords
Paraffin wax; VO2; PCM; Solid-liquid/Solid-solid transition; Emulsion synthesis; Thermal management
Categories
Funding
- National Key R&D Project from Minister of Science and Technology of China [2017YFB0406000, 2017YFB0406200]
- National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials, China (Shenzhen Development and Reform Committee) [2017-934]
- Leading Scientific Research Project of Chinese Academy of Sciences, China [QYZDY-SSW-JSC010]
- Guangdong Provincial Key Laboratory [2014B030301014]
- Guangdong province industrial -academic -research cooperation program [2014B090901017]
- National Natural Science Foundation of China, China (NSFC) [61904190]
- S1AT CAS-CUHK Joint Laboratory of Materials and Devices for High Density Electronic Packaging
- 100 Top Talents Program Research Fund of Sun Yat-sen University [76110-18841222]
- Natural Science Foundation of Guangdong Province, China [2019A1515010743]
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The paraffin is the widely used solid-liquid phase change material (PCM) with large fusion latent heat in thermal management, and vanadium dioxide (VO2) is a promising reversible solid-solid PCM with a near-ambient phase transition temperature (T-c = similar to 68 degrees C). In the real applications, the paraffin is always wrapped with inorganic or organic shells to stabilize the shape during the fusion/solidification with compromising large amounts of latent heat. Herein, we proposed the paraffin@VO2 PCM structure for the first time, which combines the solid-liquid paraffin PCM core and the solid-solid VO2 PCM shell. The paraffin@VO2 PCM structure is synthesized via an emulsion method starting with the Te/W-codoped VO2 microparticles and the paraffin wax (C26H54). This developed PCM structure shows a suitable T-c = 58.2 degrees C (Delta T-c = 5.5 degrees C), a decent fusion latent heat 163 J/g and a largely enhanced thermal conductivity 1.53 W/mK, which should be promising for the high-efficient thermal management applications. (C) 2019 Elsevier Inc. All rights reserved.
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