Development of the Backside Loading Inductive Tactile Force Sensor Using the Flip-Chip Bonding of CMOS Sensing Chip

This study presents a backside loading design inductive tactile sensor with the monolithic integration of thermometer. Based on the commercially available standard complementary metal-oxide-semiconductor (CMOS) process (the TSMC $0.35\mu \text{m}$ 2P4M CMOS process) and the in-house post CMOS processes, the sensing chip is designed and implemented. The electrical connection is further achieved by using the flip-chip bonding process, and hence the breakage of bonding wires by the tactile load can be avoided. The CMOS sensing chip consists of the magnetic sensing coil and the polysilicon RTD (resistive thermal detector). Moreover, a cavity is defined on the backside (silicon substrate) of CMOS chip to act as a mold for the polymer filler as well as the housing for the chrome steel ball contact interface. The tactile force will cause the polymer deformation and chrome steel ball displacement, and further lead to the magnetic flux change on the sensing coil. Thus, the tactile force is detected by the inductance variation of magnetic sensing coil on the CMOS chip. Moreover, the temperature variation is detected by the resistance change of RTD thermometer, and the in-situ temperature monitoring during tactile loading is achieved. The force response of the proposed tactile sensor and the temperature response of the thermometer have been characterized. The influence of temperature variation on the tactile sensor has also been calibrated. Moreover, the characteristics of the thermometer on sensing chip at different contact conditions are also investigated.