4.7 Article

An In-Vitro Study of Wireless Inductive Sensing and Robust Packaging for Future Implantable Hydrogel-Based Glucose Monitoring Applications

Journal

IEEE SENSORS JOURNAL
Volume 20, Issue 4, Pages 2145-2155

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSEN.2019.2949056

Keywords

Wireless sensor networks; Wireless communication; Prototypes; Inductance; Inductive sensing; wireless sensing; glucose monitoring; RF powering; inductive powering; sensor packaging; hydrogel; glucose-sensitive hydrogel; biomedical implant

Funding

  1. National Science Foundation [ECCS-1408265]

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A wireless inductive sensing technology with a robust packaging scheme is proposed and demonstrated for future implantable hydrogel-based glucose monitoring applications. A prototype wireless glucose sensor employs a glucose-sensitive hydrogel embedding a parylene-coated metallic sensing plate as a key sensing element. The hydrogel changes its volume responding to glucose change; thus displacing the metallic sensing plate that can be sensed by a nearby sensing coil through the coil inductance change. An ultra-low-power tunnel diode oscillator is designed to convert the inductance change to an oscillator frequency change, which can be wirelessly detected by a nearby receiver. The entire sensing system can be energized by RF powering, thus achieving a wireless and battery-less operation. The proposed sensing scheme allows the sensing electronics to be fully encapsulated in a hermetically sealed package, critical for long-term implantable applications. In vitro characterization demonstrates that the prototype sensor operated around 40 MHz can be wirelessly powered by a 2.77 mW 5 MHz power source with a distance of 2 cm, and achieves a sensing resolution of 0.05 mM and 0.3 mM within a glucose range from 0 mM to 2 mM and 8 mM to 10 mM, respectively, limited by the oscillator frequency drift and fluctuation. Furthermore, a hydrogel pillar-based design is promising to substantially shorten the system response time.

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