Journal
IEEE MICROWAVE MAGAZINE
Volume 21, Issue 1, Pages 18-34Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/MMM.2019.2945157
Keywords
Packaging; Metals; Probes; Substrates; Rectangular waveguides; Waveguide components; Micromachining
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It is difficult to package and interconnect components and devices at millimeter-waves (mm-waves) due to excessive losses experiences at these frequencies using traditional techniques. The problem is multiplied manifold at terahertz (THz) frequencies. In this article, we review the current state of THz packaging and describe several novel techniques. As we will show, micromachined packaging is emerging as one of the best choices for developing advanced THz systems.
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