Journal
CERAMICS INTERNATIONAL
Volume 45, Issue 17, Pages 23111-23118Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2019.08.005
Keywords
Silicon carbide; Joining; Spark plasma sintering; Microstructure; Refractory metals
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Funding
- Chinese Natural Science Foundation [51732009]
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In this study, Mo-W-Mo multi-interlayers were used to develop a diffusion bond with SiC-coated three-dimensional (3D) C/SiC composites by spark plasma sintering (SPS). The interfacial microstructure and the phase composition of the joints were investigated. Appropriate interfacial reaction resulted in higher interfacial bonding strengths (shear strength of the joints increased from 56 +/- 5 MPa to 83 +/- 6 MPa) for joining temperatures (lower than 1600 degrees C). However, higher joining temperatures (1800 degrees C) resulted in an excessive growth of interfacial species with high thermal expansion anisotropy (e.g., Mo5Si3 and Mo5Si3C). As a result, the thermal residual stress increase significantly and a large number of interfacial defects were generated, significantly decreasing the reliability of the joints.
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