Thermal shock resistance behavior of auxetic ceramic honeycombs with a central crack or an edge crack

In this paper, the thermal shock resistance of an auxetic ceramic honeycomb plate is studied based on the fracture mechanics concept for the cases of a central crack or an edge crack. The transient temperature field and transient thermal stress field are obtained for both auxetic and non-auxetic structures. The relationship between the thermal stress intensity factor (TSIF) and the internal cell angle, crack length and time is determined and the critical temperature for the initiation of crack propagation is predicted. Results show that compared with the non-auxetic ceramic honeycombs which are at an internal cell angle of 30 degrees, the critical temperature of the auxetic ceramic honeycombs whose cell are orientated at an angle of - 30 degrees increases by 78.5% and the TSIF at the crack tip decreases by 40%, respectively. Hence, the auxetic structures have better thermal shock resistance. This study indicates that auxetic ceramic honeycombs have significant potential applications in harsh temperature environments.