4.3 Article

Effect of Wafer Off-Angles on Defect Formation in Drift Layers Grown on Free-Standing GaN Substrates

Journal

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/pssb.201900561

Keywords

deep-level transient microscopy; GaN; point defects; wafer off-angle

Funding

  1. Ministry of Education, Culture, Sports, Science and Technology, Japan [18K04228]
  2. Grants-in-Aid for Scientific Research [18K04228] Funding Source: KAKEN

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The effect of the surface off-angle toward either the a- or m-axis on the defect formation is characterized using deep-level transient spectroscopy (DLTS) in conjunction with the carrier concentration for Ni Schottky contacts formed on n-GaN drift layers. In both noncontact and conventional capacitance-voltage results, off-angle dependence on carrier concentration is observed. For all samples, a large dominant peak appears at approximately 270 K in the DLTS spectra and is attributed to E3 (E-C - 0.57-0.61 eV) defects. Carbon atoms can act as carrier compensators and form E3 defects. These results can be interpreted based on how C incorporation during crystal growth depends on the off-angle.

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