Journal
MATERIALS LETTERS
Volume 253, Issue -, Pages 191-194Publisher
ELSEVIER
DOI: 10.1016/j.matlet.2019.06.068
Keywords
Interfaces; Aging; Diffusion; Intermetallic compounds; Mo nanoparticles
Funding
- National Natural Science Foundation of China [11604222]
- Natural Science Foundation of Liaoning Province [201601155]
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The influences of Mo nanoparticles on the growth of intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints during aging were investigated. The results reveal that Mo nanoparticles can significantly refine Ag3Sn grains and inhibit Cu6Sn5 layer thickening, which is very beneficial to the reliability of solder joints. The aging resistance originated from Mo nanoparticles is explained by diffusion theory. (C) 2019 Elsevier B.V. All rights reserved.
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