4.5 Article

Atomic layer deposition of zirconium oxide thin films

Journal

JOURNAL OF MATERIALS RESEARCH
Volume 35, Issue 7, Pages 804-812

Publisher

CAMBRIDGE UNIV PRESS
DOI: 10.1557/jmr.2019.338

Keywords

atomic layer deposition; thin film; surface chemistry

Funding

  1. Center for Advanced Surface Engineering, under the National Science Foundation [OIA-1457888]
  2. Arkansas EPSCoR Program, ASSET III
  3. National Science Foundation-Earth Sciences [EAR-1634415]
  4. Department of Energy-GeoSciences [DE-FG02-94ER14466]
  5. DOE Office of Science, Argonne National Laboratory [DE-AC02-06CH11357]

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In this work, we studied an atomic layer deposition (ALD) process of ZrO2 with the precursors of tetrakis(dimethylamido)zirconium(IV) and water. We investigated the growth characteristics and mechanism of the ALD ZrO2 in the temperature range of 50-275 degrees C. Furthermore, the evolutions of film thickness and morphology were studied and discussed. It was found that the growth rate of ZrO2 decreased almost linearly with the increasing temperature from similar to 1.81 angstrom/cycle at 50 degrees C to similar to 0.8 angstrom/cycle at 225 degrees C. Interestingly, it was revealed that the growth of ZrO2 films ceased after a certain number of ALD cycles at a temperature higher than 250 degrees C. We also verified that the crystallinity of ZrO2 evolved with deposition temperature from amorphous to crystalline phase. In addition, the wettability of ZrO2 films was studied, showing a hydrophobic nature.

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